S3 Alliance GmbH

S3 Alliance GmbH

S3 Alliance is a European distribution company providing following products for the Semiconductor/MEMS market:

Equipment:
Taping-Detaping-Mounting, Scribe and Break, ALD and Cleaning, Plasma & Ion Etch, RIE, ICP, Asher, Descuum, PECVD, Ultrasonic Spray Coating, Spin Coating, CPD (Critical Point Dryer).

Metrology & Automation:
Autonomous Mobile Robots (AMR), Integrated Sorting & Inspection Platforms, Flat/Notch Aligners, manual handling Tools, Particle measurement, H2 Impurity Measurement, Ultrasonic Flow & Fluids Concentration Measurement, Scanning Electronic Microscope (SEM), C-SAM.

Parts & Consumables:
Retaining Ring, Diamond Conditioners, CMP Pads, Grinding Wheels, Shipping boxes (new and reconditioned), Cassettes (PFA, PP, PE, PEEK), O-ring replacement for Kalrez; CMP Parts, Chamber Cleaning Materials, Chemical and DIW Heaters, Chemical Pumps. Fittings (PVDF, UHP Stainless Steel), Valves, Photoresist.

Services:
Robot repair for Yaskawa, Kawasaki, Brooks, PRI, Equip and Genmark. LFM repair Cryo Pumps repair and refurbishment, Power supply and O3 Generator repair.

Cleaning solutions:
Cleaning pads and kits for all type of chambers, Microfiber wipers.

2008

Backgrind; Slicing; Lapping; Polishing Equipment, Cleaning; Washing Equipment for Assembly & Packaging, Device Handling; Feeding Systems, Dicing; Sawing; Scribing; Separation Equipment, Wafer Mount; Taping Equipment, Lamination; Sheet Laminating Equipment, Vibration Isolation Systems, Film Thickness; Thickness; Uniformity Measurement; Ellipsometer, Flat; Notch Finding System, Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes, Microscopes: SEM; Focused Ion Beam (FIB), TEM, Resistivity Measurement; 4 point probe; Sheet resistance, Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation, Deep RIE etching; Dry Etching, Inspection and Metrology, Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment, Cleaning; Washing; Drying Equipment for Substrate, Fab Processing, Coat; Develop; Resist Processing; Track Equipment , Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD, Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment , Etching; Stripping; Ashing - Dry and Wet Equipment , CMP; Grind; Lap; Polish; Abrasive materials, Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;, Chucks for Wafer and other Substrates, Power Supplies; RF Generators; Converters; Electrical Conditioning, Pumps, for Fluids, Ultrasonic Generators; Transducer and Monitoring Systems, Contamination Control; HEPA Filtering Systems