Name
AP&S International GmbH
What We Do
AP&S International is a leading provider of chemical wet process equipment for the semiconductor industry. Among our customers are market-leading manufacturers of microchips, MEMS, photonics and optoelectronics worldwide.
Characteristic for our machines are: high throughput, superior process performance, attractive TCO values and maximum flexibility (bridge tools and customized solutions). Our portfolio includes batch and single wafer equipment including manual, semi-automated and fully automated wet process machines as well as production supporting equipment like cleaners for FOUP, SMIF and boxes, laboratory equipment and chemical management systems.
AP&S processing tools cover all common chemical wet processes used in semiconductor production chains, such as cleaning, etching, stripping, plating, developing, metal etching, e-less plating, lift-off and drying. Our equipment handles masks, wafers up to 300mm and panels, including different substrate thicknesses and wafer materials like silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), sapphire and glass, supporting advanced applications such as Through-Glass Via (TGV) processing and panel-level processing for Advanced Packaging.
The AP&S headquarters is located in Donaueschingen, Germany. The company's subsidiaries are in USA, China, Singapore and Malaysia.
Characteristic for our machines are: high throughput, superior process performance, attractive TCO values and maximum flexibility (bridge tools and customized solutions). Our portfolio includes batch and single wafer equipment including manual, semi-automated and fully automated wet process machines as well as production supporting equipment like cleaners for FOUP, SMIF and boxes, laboratory equipment and chemical management systems.
AP&S processing tools cover all common chemical wet processes used in semiconductor production chains, such as cleaning, etching, stripping, plating, developing, metal etching, e-less plating, lift-off and drying. Our equipment handles masks, wafers up to 300mm and panels, including different substrate thicknesses and wafer materials like silicon (Si), silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), sapphire and glass, supporting advanced applications such as Through-Glass Via (TGV) processing and panel-level processing for Advanced Packaging.
The AP&S headquarters is located in Donaueschingen, Germany. The company's subsidiaries are in USA, China, Singapore and Malaysia.
Founded
2003
Website
Categories (50)
Cleaning; Washing Equipment for Assembly & Packaging, Plating; Electro Chemical Plating for device assembly, Bumping Systems, Cleaning; Washing; Drying Equipment for Substrate, Fab Processing, Etching; Stripping; Ashing - Dry and Wet Equipment , Plating; Electro Chemical Plating; Deposition Systems, Chemical; Pure Water; Fluid Handling; Storage; Supply Systems, Chemical; Pure Water; Fluid Monitoring & Control Systems
Phone
0049-771-8983-154
Address
Obere Wiesen 9
Donaueschingen, 78166
Germany
Donaueschingen, 78166
Germany
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