3D-Printed Ceramics | Case Study Ring Blade

Additive manufacturing of technical ceramics enables new approaches in wafer handling. 

A large ring blade for automated handling of 200 mm wafers demonstrates these capabilities. Manufactured from high-purity alumina (>99.8%), the component combines low weight with high stiffness and flatness below 100 µm. An integrated internal channel allows gas or vacuum flow, enabling additional functions such as cooling or suction. The monolithic design eliminates assembly interfaces and reduces contamination risks. At the same time, complex internal structures can be realized without additional manufacturing steps. 

This example shows how ceramic 3D printing enables lightweight, functional, and process-stable components for semiconductor applications.

👉 Learn more: Additive manufacturing as a competitive advantage in the semiconductor industry