Stress-free Polishing

As advanced packaging pushes the limits of interconnect density and wafer complexity, traditional copper overburden removal is increasingly challenged. High topography, fragile dielectrics, and complex structures like TSVs and fan-out RDL demand greater control over surface integrity before planarization. That's the critical role of stress-free polishing (SFP).

SFP is a pre-CMP copper overburden removal step designed to minimize mechanical and thermal impact on the wafer. Unlike conventional approaches that can cause subsurface damage, dishing, or non-uniform removal, SFP gently reduces excess copper while preserving underlying structures, lowering stress to reduce defects like microcracks and delamination.

The result is a more controlled, predictable planarization process that eases the burden on slurries and pads, extends consumable life, and improves yield. ACM's SFP approach delivers low-stress, low-damage removal to enable the next generation of advanced packaging.