Carl Zeiss Microscopy Deutschland Gmbh

Carl Zeiss Microscopy Deutschland Gmbh

ZEISS provides the most comprehensive microscopy portfolio in the electronics and semiconductor industries, with superior imaging and optimized workflows to meet productivity needs for R&D, production, and failure analysis.

Defect; Particle; Bump; Contamination Detection, Review or Inspection, Die Inspection; Die Shear, Microscopes: Atomic Force Microscopes (AFM), Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes, Microscopes: Optical Microscopes, Microscopes: SEM; Focused Ion Beam (FIB), TEM, Overlay Measurement, Package Inspection; Lead Scanners, Particle Monitors; Analyzers - Airborne or Liquid, Spectrometers; FTIR; ATR-FTIR; Auger Electron (AES); SIMS, Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation, Wire Bonding Inspection; Test, X-ray; XRF; 3-D X-Ray; LEXES Systems, Equipment, Nanotechnology Tools, Ion; E-Beam Milling Etching Equipment, Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint, Circuit Repair; Design Modification; Redundant Memory Repair; Mask Repair Systems, Failure Analysis Systems, Functional Test Systems, Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers, Simulation; Characterization; Verification Software, Measurement; Inspection Service, Product Development; Software Design; Product Lifecycle Management, Software Programming; Software Development , Imaging: Image Processing, Software and System, Imaging: Optics and Micromechanic